We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Through hole processing.
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Through hole processing Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Through hole processing Product List

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Micro through-hole processing (TGV)

Micro through-hole processing (TGV)

The substrate types include alkaline glass and heat-resistant glass! Achieving long, narrow fine hole drilling.

At Musashino Fine Glass, we have developed a technology that performs etching after modifying the glass using lasers. By irradiating with ultra-short pulse lasers, we create regions with different physical properties within the glass, allowing us to etch into the desired shapes. This processing method, which combines "laser" and "etching," enables the realization of long and narrow fine hole drilling that was previously difficult to achieve. 【Examples of Achievements】 ■ Aspect ratio of approximately 5, substrate thickness 0.4mm, hole diameter φ80μm ■ Aspect ratio of approximately 7.5, substrate thickness 0.6mm, hole diameter φ80μm ■ Aspect ratio of approximately 2.8, substrate thickness 0.5mm, hole diameter φ180μm *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Glass through-hole processing using sandblasting and wet etching methods.

Glass through-hole processing using sandblasting and wet etching methods.

We can also create wiring patterns for both sides of the glass and multilayer wiring, so please feel free to consult with us!

We offer a "glass through-hole processing service using sandblasting + wet etching methods." We accommodate thin to thick metal films such as ITO / Cr / Ti / Al / Au / Ag / Cu / Ni / Mo alloys. We can also create wiring patterns and multilayer wiring on both sides of the glass, so please feel free to consult with us. 【Substrate Details】 ■ Alkali-free glass ■ φ12 inches × 0.3 mm thick ■ Aperture diameter: φ150 μm ■ Pitch: 300 μm ■ Number of holes: 700,000 ■ Metal film: 8,000 Å *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Glass through-hole processing

Glass through-hole processing

The superiority of the Ebina proposal process! Achieving ultra-high density fine holes without cracks or chipping.

Our processing technology enables the creation of glass without cracks or chips, and allows for ultra-high-density fine holes. The roughness of the sidewalls of the through holes is Ra0.08μm. We can achieve smooth sidewalls, enabling miniaturization and integration of devices. The shapes of the through holes can be selected from straight, hourglass, or tapered. 【Features】 ■ No cracks or chips ■ Smooth sidewalls ■ Ultra-high-density fine holes ■ Miniaturization and integration of devices *For more details, please refer to the PDF document or feel free to contact us.

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  • Processing Contract
  • Circuit board processing machine

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Examples of yield improvement and cost reduction in metal processing due to changes to through holes.

Examples of yield improvement and cost reduction in metal processing due to changes to through holes.

By reducing the number of cutting tools used by one, it is possible to lower costs as processing time can also be shortened!

We will process a stop hole with a diameter of φ6H7 and an effective depth of 7mm in a thin plate with a thickness of 8mm. In this case, it is necessary to machine the hole as close to being through as possible and finish the bottom of the hole to a flat surface. Therefore, we will process in the following order: [φ5.0 drill → flat end mill → chamfering → φ5.9 end mill → φ6 reamer]. One issue is that reamers with larger cutting edge surfaces cannot be used, which can cause the entrance to become misaligned and larger, leading to reduced yield. If there is no problem with the pilot hole being through, we can omit the machining with the flat end mill by making it a through hole. As a result, the number of cutting tools used is reduced by one, and machining time is also shortened, which helps to lower costs. [Case Study] ■ Content: Improvement of yield and cost reduction in metal processing by changing to a through hole ■ Issue: The entrance becoming misaligned and larger, causing reduced yield ■ Proposal: Make it a through hole if there is no problem with the pilot hole being through ■ Application: Cost reduction, cutting processing, machining, lathe work, precision processing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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